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for WPC 200 Advance

Collective 200 mm wafer packing equipment

The semiconductor industry manufactures ICs on wafers that need to be stored at or sent to and from different manufacturing plants - frontend, back-end, or customer plants. The NBS WPC 200 automated wafer packing solution in collective canisters was designed to maintain wafer integrity and traceability during the handling and packing process.

The main purpose of the NBS WPC 200 Advance is to safely pack 200 mm silicon wafers into horizontal wafer shippers before they are shipped to assembly sites or at the assembly site itself. The equipment was designed to transfer 200 mm wafers from a wafer process open carrier (OC) to a horizontal wafer carrier (HWS) and vice-versa with minimal damage. In fact, the NBS WPC 200 Advance is one of the safest, most reliable and cost-effective solutions for your automated wafer storage and shipment needs.

NBS’s Collective 200 mm Wafer Packing Equipment provides several benefits to semiconductor manufacturers:

• manages the logistics process (traceability)
• improves wafer yield
• reduces wafer packing costs
• reduces wafer loss

If your requirement is for 300mm wafer handling, see our WPC 300. Also, see our wafer backside inspection equipment for 200mm wafers.