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technical specifications
for WPC 300

Collective 300 mm wafer packing equipment

The semiconductor industry manufactures ICs on wafers that need to be stored at or sent to and from different manufacturing plants - frontend, back-end, or customer plants. The NBS WPC 300 automated wafer packing solution in
collective canisters was designed to maintain wafer integrity and traceability during the handling and packing process.

The main purpose of the NBS WPC 300 is to safely pack 300 mm silicon wafers into horizontal wafer shippers before they are shipped to assembly sites or at the assembly site itself.
The equipment was designed to transfer 300 mm wafers from a wafer process carrier (FOUP/FOSB) to a horizontal wafer carrier (HWS) and vice-versa with minimal damage. In fact, the NBS WPC 300 is the safest, most reliable and cost-effective solution for your automated wafer storage and shipment needs.

If your requirement is for 200mm wafer handling, see our WPC 200 Advance . Also, see our wafer backside inspection equipment for 200mm wafers.